Intel and 3DGS Sign MoU With Odisha for Glass Substrate Chip Facility
The Odisha government has signed a Memorandum of Understanding with Intel Corporation and 3DGS to establish an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar–Khurda region of the state. The Ministry of Electronics and IT (MeitY) has described the project as one of the largest high-technology manufacturing investments in India to date.
The proposed facility will manufacture advanced packaging glass core substrates and high-density interconnect substrates, along with associated semiconductor packaging technologies. Intel will contribute technology know-how and process expertise to the project.
Implementation is planned in phases over a period of five to six years. The facility is expected to generate substantial direct employment in high-skilled roles, as well as broader indirect employment across the manufacturing and technology ecosystem in the region.
The project is positioned to support capability development, semiconductor ecosystem growth, and export-oriented manufacturing within India's broader electronics and chip packaging value chain.
The MoU adds to a series of recent commitments by global semiconductor industry players in India, which have included technology and supply chain partnerships involving companies such as Applied Materials, Lam Research, Tokyo Electron, Merck Electronics, Tata Electronics, and ASML.