Paras Semiconductors Private Limited, a subsidiary of Paras Defence and Space Technologies Limited, is establishing a state-of-the-art greenfield Advanced Semiconductor Packaging facility in the Indore-Ujjain region of Madhya Pradesh. Operating as an Outsourced Semiconductor Assembly and Test (OSAT) plant, the facility will execute high-end integrated-circuit packaging processes, including 2.5D and 3D heterogeneous integration, hybrid bonding, wafer bumping, and chiplet integration for AI, defense, and high-performance computing applications. Representing a capital outlay of ₹62,000 million (₹6,200 Crore), the project is expected to create over 2,500 direct technical jobs. As of July 2026, the company signed a Memorandum of Understanding (MoU) with the MP State Electronics Development Corporation (MPSeDC).