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intel corporation News & Updates - July 7, 2026
Intel and 3DGS Sign MoU With Odisha for Glass Substrate Chip Facility
Manufacturing - May 30,2026
The Odisha government, Intel Corporation, and 3DGS have signed an MoU to set up an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar–Khurda region. .
Manufacturing - May 30,2026
The Odisha government, Intel Corporation, and 3DGS have signed an MoU to set up an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar–Khurda region. .