3dgs News - CapEx News
Project News,Updates,Bids & Tenders for Consultants,EPC Contactors,Industrial Suppliers & Service Providers
3dgs News & Updates - July 7, 2026
Intel and 3DGS Sign MoU With Odisha for Glass Substrate Chip Facility
Manufacturing - May 30,2026
The Odisha government, Intel Corporation, and 3DGS have signed an MoU to set up an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar–Khurda region. .
Manufacturing - May 30,2026
The Odisha government, Intel Corporation, and 3DGS have signed an MoU to set up an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar–Khurda region. .