RRP Electronics has signed a memorandum of understanding (MoU) with AMB, Taiwan to collaborate for memory modules - SPI Nand, Microsd, Emmc, and Ssd and production to the tune of USD 25 million, to start with initially.

With extended capacities, the technology covers complete package structure details, substrate designs, test program development and supporting tool design.

For RRP Electronics, this association which will be deployed immediately at its OSAT facility in Maharashtra will have these parts being supplied to Samsung and many leading corporates, and "the OSAT facility by virtue of this association promises a USD 25 million revenue per annum in the coming times.”