Darshan Hiranandani, Hiranandani group's chief executive officer, the Hiranandani real estate conglomerate, which is foraying into the semiconductor industry through its company Tarq Semiconductors, anticipates receiving government approval for its compound semiconductor fab project within the next two months.

In order to build a compound semiconductor fab facility and assembly, testing, marking, and packaging (ATMP) unit in Uttar Pradesh, the company has submitted applications for each. Compound semiconductors play a crucial role in high-power and high-temperature products and applications such LED, radio frequency devices, electronic gadgets, cars, etc.

ATMP or chip assembly and packaging comes into play after semiconductor fabrication. It is the next step in the semiconductor value chain.

“We have already completed the application for ATMP as well as submitted our compound semiconductor fab project with the government. We expect to get all approvals from the government within the next 30 to 60 days,” Hiranandani said.