Assam will soon get a semiconductor packaging plant worth nearly Rs 25,000 crore and secure its first investment in such a facility.

Union Minister of State for Electronics and IT, Rajeev Chandrasekhar stated this while addressing the first-ever 'Digital India Future Skills Summit' in Guwahati.

This facility would be established in partnership with the Assam government and Tata Group and the procedure to obtain approval will be set into motion early on. The proposal would be submitted to the Cabinet for final approval.

With regard to employment opportunities that will open up due to such endeavours, the Minister emphasised that in the coming years, skills in areas such as AI, cybersecurity and semiconductors would be key.

PM Modi's three-pronged strategy 'futureDESIGN' for design innovation, 'futureLABS' for innovation around systems, and 'futureSKILLS' aims to prepare young Indians with capabilities in emerging sectors such as semiconductors.