Rs.62000 Million New Advanced Semiconductor Packaging Facility in Madhya Pradesh
A greenfield Outsourced Semiconductor Assembly and Test (OSAT) packaging facility is planned in the Indore-Ujjain region of Madhya Pradesh with an investment of ₹62,000 million. Featuring 2.5D/3D packaging, chiplet integration, and wafer bumping, the project secured a Memorandum of Understanding with the MP State Electronics Development Corporation in July 2026, creating over 2,500 direct jobs.
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