Pre Project Stage Electronics, Semiconductors & Data Centers Private Sector
Rs.62000 Million New Advanced Semiconductor Packaging Facility in Madhya Pradesh
- Investment
- From 5000 Million to 49999 Million
- Stage
- Pre Project Stage
- Location
- NA, Madhya Pradesh
- Last updated
- 24 Jul 2026
Project summary
A greenfield Outsourced Semiconductor Assembly and Test (OSAT) packaging facility is planned in the Indore-Ujjain region of Madhya Pradesh with an investment of ₹62,000 million. Featuring 2.5D/3D packaging, chiplet integration, and wafer bumping, the project secured a Memorandum of Understanding with the MP State Electronics Development Corporation in July 2026, creating over 2,500 direct jobs.
Project details
| Segment | Electronics, Semiconductors & Data Centers |
|---|---|
| Industry | Manufacturing |
| Products & capacity | Semiconductor |
| District | NA |
| State | Madhya Pradesh |
| Investment | From 5000 Million to 49999 Million |
| Project type | New |
| Ownership | Private Sector |
| Stage | Pre Project Stage |
| Last updated | 24 Jul 2026 |
| Promoter / company | 🔒 Subscribers only Unlock |
| Site location & address | 🔒 Subscribers only Unlock |
| Promoter contact | 🔒 Subscribers only Unlock |
| Decision makers | 🔒 Subscribers only Unlock |
| Milestone history | 🔒 Subscribers only Unlock |
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