Under Implementation Electronics, Semiconductors & Data Centers Private Sector
Rs.2802 Million Semiconductor Packaging and Mfg. Unit in Khordha, Odisha
- Investment
- From 1000 Million to 4999 Million
- Stage
- Under Implementation
- Location
- Khordha, Odisha
- Last updated
- 25 Mar 2026
Project summary
A ₹280.25 crore advanced semiconductor packaging unit is planned for Jatni, Odisha, spanning 25 acres. The facility focuses on next-generation glass substrate-based manufacturing, a critical technology for high-performance computing. As of March 2026, the project is awaiting environmental clearance from SEIAA, with a fast-tracked construction timeline scheduled from October 2026 to July 2027.
Project details
| Segment | Electronics, Semiconductors & Data Centers |
|---|---|
| Industry | Manufacturing |
| Products & capacity | Advanced Glass Substrate-Based Semiconductor |
| District | Khordha |
| State | Odisha |
| Investment | From 1000 Million to 4999 Million |
| Project type | New |
| Ownership | Private Sector |
| Stage | Under Implementation |
| Last updated | 25 Mar 2026 |
| Promoter / company | 🔒 Subscribers only Unlock |
| Site location & address | 🔒 Subscribers only Unlock |
| Promoter contact | 🔒 Subscribers only Unlock |
| Decision makers | 🔒 Subscribers only Unlock |
| Milestone history | 🔒 Subscribers only Unlock |
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