Under Implementation Electronics, Semiconductors & Data Centers Private Sector
Rs.19435 Million New 3D Semiconductor Chip Packaging Unit in Bhubaneswar, Odisha
- Investment
- From 5000 Million to 49999 Million
- Stage
- Under Implementation
- Location
- Khordha, Odisha
- Last updated
- 20 Apr 2026
Project summary
A high-tech semiconductor packaging facility is being established to manufacture advanced 3D glass substrate-based chip packaging products with an annual capacity of 70,000 glass panels, 50 million assembled units and 13,200 3DHI modules. The project involves an investment of about Rs 19435 million and will support applications in AI, 5G, defence and high-performance computing. Located at Info Valley in Bhubaneswar, the unit has received government approvals under the India Semiconductor Mission and is expected to be completed by August 2028 with full-scale production targeted by August 2030.
Project details
| Segment | Electronics, Semiconductors & Data Centers |
|---|---|
| Industry | Manufacturing |
| Products & capacity | Glass panels (70000 units per year), Assembled semiconductor units (50000000 units per year), 3DHI modules (13200 units per year) |
| District | Khordha |
| State | Odisha |
| Investment | From 5000 Million to 49999 Million |
| Project type | New |
| Ownership | Private Sector |
| Stage | Under Implementation |
| Last updated | 20 Apr 2026 |
| Promoter / company | 🔒 Subscribers only Unlock |
| Site location & address | 🔒 Subscribers only Unlock |
| Promoter contact | 🔒 Subscribers only Unlock |
| Decision makers | 🔒 Subscribers only Unlock |
| Milestone history | 🔒 Subscribers only Unlock |
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