Rs.2802 Million Semiconductor Packaging and Mfg. Unit in Khordha, Odisha
A ₹280.25 crore advanced semiconductor packaging unit is planned for Jatni, Odisha, spanning 25 acres. The facility focuses on next-generation glass substrate-based manufacturing, a critical technology for high-performance computing. As of March 2026, the project is awaiting environmental clearance from SEIAA, with a fast-tracked construction timeline scheduled from October 2026 to July 2027.
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