Rs.271200 Million New Semiconductor Assembly and Test Facility in Morigaon, Assam
A company plans a semiconductor assembly and test facility in Morigaon, Assam, with monthly capacities of over 3 billion wire bonds, 612 million flip chips, and 172 million integrated system packages. Supported by 10 DG sets of 2,250 KVA each, the project addresses growing global semiconductor demand. The estimated investment is ₹271,200 million, and as of February 2026, state pollution control consent has been obtained.
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