CDIL Semiconductors (Continental Device India), India's first semiconductor chip and component maker, will add additional semiconductor packaging lines under the SPECS programme developed by the government of India and MeitY.

CDIL hopes to raise its annual capacity by 100 million units with the new lines. The first phase of this production began with a surface mount packaging line capable of producing 50 million gadgets, which will be launched on 28 September by Rajeev Chandrasekhar, Union Minister of State for Electronics and Information Technology, Skill Development, and Entrepreneurship.

CDIL has over 59 years of legacy as a semiconductor and electronics service provider to customers globally across consumer, industrial, defence, aerospace and automotive.

The company supplies to its customers across USA, UK, Germany, China, Hong Kong, Japan, South Korea, South Africa, and Egypt.

Prithvideep Singh, General Manager, CDIL Semiconductors said, “In line with our steadfast commitment to innovation and market diversification, CDIL Semiconductors has strategically positioned itself to meet the burgeoning demands of the industry especially the power electronics, automotive, and defence sectors, both within India and on a global scale. As we reflect upon this progress, we recognise that this is only the beginning. The groundwork has been established and will stand as a pivotal cornerstone for the company’s future endeavours.”