Paras Defence enters semiconductor space with advanced packaging subsidiary
Manufacturing
Jan 22,2026
Paras Defence and Space Technologies has launched a subsidiary focused on advanced semiconductor packaging technologies.
The move marks a strategic diversification beyond traditional defence manufacturing.
Advanced packaging is a critical capability for defence electronics and aerospace systems.
The initiative aligns with India’s broader push to build domestic semiconductor depth.
Execution capability will determine how quickly the company scales in this space.
Company :
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Paras Defence and Space Technologies