Odisha Has Five Semiconductor Projects Under Construction, Including SiCSem Silicon Carbide Fab and 3D Glass Solutions Glass Substrate Facility; State Approves ₹11,000 Crore Investments
Odisha Chief Minister Mohan Charan Majhi said five semiconductor projects are under construction in the state, with discussions on three more. He spoke at SEMICON India 2026 in New Delhi. The state is in talks with around 10-12 companies from countries including Sweden and Japan over potential semiconductor investments.
Two of the 12 projects approved by the Centre under the India Semiconductor Mission are in Odisha, and construction is under way on both. SiCSem Private Limited is setting up a silicon carbide semiconductor fab and integrated packaging facility. 3D Glass Solutions is developing an advanced glass substrate packaging facility.
The state government has separately approved five semiconductor projects with investment of about ₹11,000 crore. They are expected to create about 4,500 direct and over 16,000 indirect jobs. The Chief Minister also referred to an MoU between Intel and 3D Glass Solutions for an investment of about USD 3.3 billion (₹30,550 crore), with over 1,800 direct jobs.
The state has identified 870 acres near Naraj, between Cuttack and Bhubaneswar, for a proposed semiconductor cluster for future projects. It will give additional capex support of up to 25 per cent to projects approved under the India Semiconductor Mission.
