India’s first 3D chip packaging unit foundation laid in Bhubaneswar
Manufacturing
Apr 20,2026
The foundation stone has been laid for India’s first 3D semiconductor chip packaging unit in Bhubaneswar, marking a significant advancement in the country’s semiconductor value chain.
The facility will focus on advanced packaging technologies critical for next-generation electronics.
Such capabilities are essential for moving up the semiconductor manufacturing value chain.
The project reinforces India’s ambition to build a comprehensive semiconductor ecosystem.
Company :
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Bhubaneswar Municipal Corporation
