CapEx News
Project News,Updates,Bids & Tenders for Consultants,EPC Contactors,Industrial Suppliers & Service Providers
Noida-based Sahasra Electronics is planning to set aside a capex of around Rs 350 crore in the next three years to establish a semiconductor packaging facility and increase manufacturing under the ‘Make in India’ program.
The new facility will be constructed at Bhiwadi in Rajasthan, where the company already has a semiconductor plant.
The company will be investing in machines for the electronic assembly, thus, investment in the plant will be an excess of Rs 150 crore and in the building interior itself about Rs 50 crore.
Sahasra Group's Sahasra Semiconductors (SSPL) has become one of the first Indian companies to start packaging and testing NAND flash memory in this financial year as well as first company to receive a production linked incentive (PLI ) scheme in 2020.
NAND flash memory is a non-volatile storage technology that retains data without power.
Last month, Saharsa Electronics partnered with French Thomson Computing to streamline the latter's manufacturing in India to produce a range of laptops and tablets to cater to the increasing demands. In addition, the company maintains a partnership with a Taiwanese company for memory drives.
Sahasra Semiconductors
French Thomson Computing
Recent News
◉ SWELECT Energy secures over 150 MW of solar module - Mar 13,2025◉ RVNL emerges as lowest bidder for Rs 554.64 crore road contract - Mar 13,2025
◉ MoU inked for developing Multi-Modal Logistics Park in Varanasi - Mar 13,2025
◉ Danfoss India to invest Rs 1,200 crore by 2028 - Mar 13,2025
◉ SJVN to develop Rs 9,500 crore pumped storage project - Mar 13,2025
◉ JNPA signs concession agreement for Rs 285-crore agri-processing facility - Mar 13,2025
◉ Montra Electric opens e-SCV manufacturing plant in Chennai - Mar 13,2025